Duoyang Huang

Design Engineer at Micron Technology

Duoyang (Byron) Huang is a design engineer with extensive experience in the semiconductor industry, currently working at Micron Technology since May 2022. Prior to this role, Duoyang served as a design engineer at TSMC North America from August 2020 to April 2022. Duoyang's academic background includes a Master’s degree in Electrical and Computer Engineering from Georgia Institute of Technology, attained in 2020, and a Bachelor's degree in Electrical Engineering from Bucknell University, earned in 2018. Additionally, Duoyang has experience as a graduate research assistant at Georgia Institute of Technology, focusing on the theoretical analysis and simulation of a 369.5nm GaN UV VCSEL, and as a Presidential Fellow Researcher at Bucknell University, where research concentrated on electrodeposition of ZnO and ZnTe thin films for solar cell applications.

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