Michael Oppenheim

Head Of Packaging Technology Global, Milliporesigma at MilliporeSigma

Michael Oppenheim has over 30 years of experience in the field of package engineering and design. Michael'scareer includes roles at companies such as Repligen Corporation, EMD Millipore, Unicorr Packaging Group, Smurfit Stone Corp, and arthur d little. This experience has provided him with expertise in global package engineering, packaging technology, commodity management, and industrial design.

Michael Oppenheim obtained an Associate of Science (A.S.) in Mechanical Design from Wentworth Institute of Technology in 1990, followed by a Bachelor of Science (BS) in Industrial Design in 1993 from the same institution. Additionally, there is a listing for attending King Philip, but no specific degree or field of study is provided.

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Timeline

  • Head Of Packaging Technology Global, Milliporesigma

    November, 2012 - present

  • Global Packaging Eng | Commodity Mgr

    March, 2008