Mark Curtice, BS, MS

Mark Curtice has a diverse work experience spanning several companies in the semiconductor industry. Mark started their career at White Oak Semiconductor as an Etch Process Owner, where they were responsible for overseeing all aspects of plasma etch processes. Mark then moved on to Fairchild Semiconductor as a Thin Films Development Engineer, where they developed and integrated processes for various technologies.

After that, Curtice joined Intel Corporation as a Plasma Etch Engineer, sustaining plasma etch processes and executing cost reduction and yield improvement projects. Mark also worked as an FEOL Integration Engineer at Intel, managing the integrated performance of processes and coordinating with process experts to investigate and prevent excursions.

Curtice then joined GLOBALFOUNDRIES as a Technology Development FEOL Integration Engineer, where they developed and qualified integrated process modules in 20nm CMOS technology. Mark also served as a Design Rule Validation Engineer at GLOBALFOUNDRIES, providing electrical validation of design rules and driving process improvement activities.

Currently, Curtice is working at NexGen Power Systems as a Senior Manager of Process Engineering. Mark previously held the role of Process Engineering Manager at the same company. Mark also has experience as a Principal Process Integration Engineer at NexGen Power Systems.

Throughout their career, Curtice has demonstrated a strong technical background and expertise in process engineering, integration, and validation within the semiconductor industry.

Mark Curtice has a Bachelor of Science degree in Electrical Engineering from the University of Southern Maine. Mark also holds a Master of Science degree in Materials Science from Columbia Engineering. No specific start or end years are provided for either degree.