Brian Bersch

Brian Bersch is a Principal Process Integration Engineer at Northrop Grumman Mission Systems' Advanced Technology Lab, specializing in compound semiconductors and emerging technologies since October 2018. Prior to this role, Brian served as a Technical Intern at the same lab, focusing on mask development and process integration for GaN-based devices. Brian's academic background includes a PhD in Materials Science and Engineering and a BS in Engineering Science from Penn State University, where experiences as a Graduate Research Assistant involved fabricating electronic devices and investigating two-dimensional materials. Additionally, Brian gained practical experience through internships at Assured Testing Services and the Center for Advanced Infrastructure and Transportation at Rutgers University.