Tay-Jeng Chu

Tay-Jeng Chu is a Principal Engineer in Process Integration at TSMC, with a career at the company beginning in August 2015. Currently involved in startup work at the new fab in TSMC Arizona, Tay-Jeng has a wealth of experience as a Sr. Process Integration Engineer, where responsibilities included managing customer relationships, maintaining semiconductor manufacturing processes, and conducting statistical analyses for yield improvement across various technologies. Previous experience as a Process Engineer in the Advanced Packaging Department involved daily production support and the management of automated systems. Tay-Jeng's academic background includes a Master’s Degree in Materials Science & Engineering from the University of Illinois Urbana-Champaign and a Bachelor of Science in the same field from the Illinois Institute of Technology, complemented by an International Baccalaureate diploma from Munich International School e.V.