Sean Sivapalan

Sean Sivapalan has a diversified work experience starting from Shell in 2005 as a Materials Design engineer, then moved to the University of Illinois at Urbana-Champaign as a NIH Midwest Cancer Center Fellow, and later joined Intel Corporation in 2013. At Intel, they held various roles including Technology Development Engineer, Senior Packaging Research and Development Engineer, and Staff Materials Engineer. In 2021, they joined the Open Compute Project Foundation as the Advanced Cooling Solutions Cold-Plate Sub Project Lead, before working at Meta as a Technical Sourcing Manager in 2022. Currently, Sean holds the position of Principal Materials Engineer in Data Center Engineering at NVIDIA starting in 2023.

Sean Sivapalan completed their MEng (Hons) in Materials Science and Engineering from Imperial College London in 2007. Sean then pursued a PhD in the same field at the University of Illinois Urbana-Champaign from 2007 to 2012. In 2019, Sean obtained a Master of Business Administration (MBA) from the W. P. Carey School of Business at Arizona State University, completing their formal education in 2021.