Tim Ford

Tim Ford is an experienced IT professional with a strong background in systems engineering and project management. Currently serving as Project Lead at Packaging Corporation of America since March 2012, Tim oversees projects for one of the largest producers of containerboard and corrugated packaging products in the U.S. Prior roles include Senior Systems Engineer positions at POWER Engineers and SuperValu, as well as a Senior System Manager at Micron Technology, Inc. Tim's expertise extends to managing corporate Windows infrastructure and data center environments, notably as a Senior member of the Corporate Windows Infrastructure Engineering team at Boise. Tim holds a degree in Computer Information Systems from Boise State University, obtained between 1989 and 1994.