PalPilot International Corporation
Philip Tsai is an experienced program manager currently leading the Packaging Division at PalPilot International Corp. since March 2019. Prior to this role, Philip served as a project manager at ECS ELITEGROUP (USA) from January 2015 to March 2019, where responsibilities included managing accounts in the Northern America region focusing on Intel and AMD products. Earlier experience includes working as a 3D Design Artist and Quality Assurance specialist for Apple from 2012 to 2014, where contributions enhanced 3D content for iOS applications. Philip holds a Master of Fine Arts (MFA) in Game and Interactive Media Design from the Academy of Art University and a Bachelor of Fine Arts (BFA) in Interior Design from San Jose State University.
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PalPilot International Corporation
PalPilot International Corp, a world class provider of customized solutions in the core industries of PCB Engineering, Manufacturing, and Components for over 25 years.