PiBond
Feng Xu has extensive work experience in various scientific and business development roles. From 2017 onwards, Feng Xu worked at PiBond, initially as a Business Coordinator from March 2017 to November 2019, and later as a Business Development Manager starting in November 2019. Prior to that, Feng Xu was a visiting scientist at the University of Helsinki from June 2014 to September 2014. From June 2011 to September 2014, Feng Xu worked as a Scientist at the Karlsruhe Institute of Technology (KIT), and from October 2007 to May 2011, Feng Xu was a Researcher at KIT. Additionally, Feng Xu gained experience as a visiting researcher at the ESRF - European Radiation Synchrotron Facility from July 2008 to June 2010.
Feng Xu completed a Bachelor's Degree in Plasma Physics from the University of Science and Technology of China between 1999 and 2004. From 2004 to 2007, they pursued a Master's Degree in Physics with a focus on Optics at the Chinese Academy of Sciences. Later, between 2007 and 2011, Feng Xu earned a Doctor of Philosophy (Ph.D.) in Physics, specializing in 3D X-ray imaging, from the Karlsruhe Institute of Technology (KIT).
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PiBond
Pibond is manufacture a broad range of unique electronic materials,which meets customers' stringent performance and integration requirements. We currently supply materials from all of our product lines to leading foundries in the world.We specialize in the development and production of advanced siloxane and metal oxide monomers and polymers.Many of the products we manufacture are essential in construction of new, next generation of devices, or helping to reduce our customer’s production costs and improving quality. Our materials are currently being used by customers at multiple nodes including “10 nm class” advanced semiconductor devices.The expertise we have in product development, application engineering and state-of-the-art production techniques ensures fast time to market for customers, delivering the performance required for even the most advanced device designs.Apart from being used at multiple nodes within the semiconductor industry, Pibond also offers and develops materials for MEMS and Advanced IC Packaging. Industrial trends like The Internet of Things are increasing the demands for Wafer Level and emerging 3D-IC packaging architectures.