PiBond
Lioubov Kartseva has a background as a Laboratory Engineer at PiBond since October 2022. Prior to that, they worked as a Research Laboratory Technician at MetropoliLab Oy from August 2020 to October 2022. Lioubov also has experience as a Laboratory Technician at SGS from August 2017 to August 2020. Additionally, they worked as a Laboratory Technician at SYNLAB Analytics & Services Finland Oy, where they conducted analysis of volatile organic compounds and hydrocarbons from soil and water samples, and validated an analytical method for analysis of total hydrocarbon index in various water samples for their final thesis. Lioubov also worked at SYNLAB Analytics & Services Finland Oy as a Laboratory Technician, focusing on fluoride, chloride, and acidity/alkalinity analysis using titration and ion-selective electrodes on waste materials, soil, and fertilizers, as well as general laboratory maintenance and quality control.
Lioubov Kartseva pursued their education at the Metropolia University of Applied Sciences from 2014 to 2017. During this time, they completed a Bachelor's degree in Laboratory Services, specializing in Laboratory Sciences.
PiBond
Pibond is manufacture a broad range of unique electronic materials,which meets customers' stringent performance and integration requirements. We currently supply materials from all of our product lines to leading foundries in the world.We specialize in the development and production of advanced siloxane and metal oxide monomers and polymers.Many of the products we manufacture are essential in construction of new, next generation of devices, or helping to reduce our customer’s production costs and improving quality. Our materials are currently being used by customers at multiple nodes including “10 nm class” advanced semiconductor devices.The expertise we have in product development, application engineering and state-of-the-art production techniques ensures fast time to market for customers, delivering the performance required for even the most advanced device designs.Apart from being used at multiple nodes within the semiconductor industry, Pibond also offers and develops materials for MEMS and Advanced IC Packaging. Industrial trends like The Internet of Things are increasing the demands for Wafer Level and emerging 3D-IC packaging architectures.