Eric Lewandowski

Eric Lewandowski's work experience is as follows:

From 2021 to present, Eric is a Senior Staff Engineer and Manager (Integrated Chip Performance) at Quantum-Si. Eric manages the Chip Performance Integration group, which focuses on flow-cell and optical packaging development and integration.

From 2016 to 2021, Eric worked at IBM. Eric was the Manager of the Quantum Packaging Fabrication group from 2020 to 2021. Prior to that, they were a Research Staff Member, where they fabricated multi-qubit hardware for IBM Quantum and developed key electronic packaging technologies. Eric also integrated multiple quantum technologies to create high-value research devices.

From 2014 to 2016, Eric was a Senior Researcher at ExxonMobil. Eric conducted empirical studies and developed a theory to examine structure-property relationships of extended surfactants. Eric also created a measurement technique for the characterization of low-conductivity fluids.

From 2010 to 2014, Eric worked at IBM as a Research Staff Member. During this time, they conducted research on underfill failure modes and collaborated with clients on product enhancement through market analysis and material science research.

From 2008 to 2010, Eric was a Postdoctoral Researcher at the University of Pennsylvania. Eric modeled complex capillary phenomena, validated models with empirical research, and utilized engineered particles and fabricated structures to create novel assemblies.

Eric Lewandowski completed their education in a chronological order. Eric first attended the University of Massachusetts Amherst from 1999 to 2002, where they obtained a Bachelor of Science degree in Chemical Engineering. Following this, from 2002 to 2008, Eric pursued a Doctor of Philosophy degree at The Johns Hopkins University in Chemical and Biomolecular Engineering.