David Goldstein

David Goldstein has extensive experience in packaging and architectural design. Currently serving as an Engineering Intern at Rand Whitney Packaging since March 2012, David specializes in providing specifications for protective packaging using various materials. Additionally, David has been a Student in the Packaging Science Master's program at the Rochester Institute of Technology since September 2011, contributing as a Lab Technician in the Packaging Dynamics Laboratory. Prior experience includes working as an Intern Architect at Clark Patterson Lee, where David took on the roles of Project Architect and Construction Administrator for fire department renovations, overseeing design, drafting, code analysis, and team coordination. David holds a Master of Science in Packaging Science from the Rochester Institute of Technology and a Master's degree in Architecture from both Buffalo State University and the University at Buffalo.