A R Nazmus Sakib

A R Nazmus Sakib, Ph.D., is a seasoned semiconductor packaging engineer with extensive experience in packaging development and materials engineering. Currently serving as Staff Semiconductor Packaging Engineer at Renesas Electronics, A R Nazmus Sakib leads full-cycle semiconductor package development, collaborating with cross-functional teams to ensure product performance while addressing complex technical challenges. Previous roles include IC Package Materials Engineer at NXP Semiconductors, where expertise in high-reliability packaging materials was demonstrated, and a Visiting Assistant Professor at Alabama Agricultural and Mechanical University. A R Nazmus Sakib holds a Ph.D. in Mechanical Engineering from The University of Texas at Arlington and a Bachelor's degree in Mechanical Engineering from Bangladesh University of Engineering and Technology.