Jim Caravella possesses extensive experience in engineering and leadership roles within the semiconductor industry. Currently serving as VP of Power Technology, Incubation and Product Engineering at Renesas Electronics, Caravella has previously held titles such as VP Engineering - PMIC at Dialog Semiconductor and VP of Engineering at NXP Semiconductors, where additional responsibilities included serving as Sr Director of R&D. Prior roles also include Director of Engineering at Qualcomm and Airgo Networks. Caravella holds a Master of Science in Electrical Engineering (MSEE) with a specialization in Analog IC design from the Georgia Institute of Technology, completed between 1987 and 1991.
January, 2024 - present
Principal Group Product Manager at Microsoft
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