Samsung
Se Young (Harry) Yang is an accomplished executive in hardware engineering with extensive experience in the mobile technology sector. Currently serving as Executive VP of Hardware Engineering for the Mobile eXperience (MX) Division at Samsung Electronics since November 2017, Yang leads hardware design, verification, and integration for a range of devices including smartphones and tablets. Prior to this role, Yang held the position of VP of Hardware Engineering within the same division, driving technical innovations for IC packaging and integration. Yang's career includes significant positions at Apple as an Engineering Manager focusing on semiconductor packaging, and at Tessera as a Senior Packaging and Reliability Engineer. Educational qualifications include a Post Doctorate in Mechanical Engineering from the Massachusetts Institute of Technology and a Ph.D. from the Korea Advanced Institute of Science and Technology.
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