Venkat Medisetti

Venkat Medisetti is currently the Head Of Engineering at ScanPay. Prior to this role, Venkat worked at JPMorgan Chase & Co. as the Core Engineering India Head for Credit Risk. Before that, Venkat was the Liquidity Technology India Head at Bank of America, focusing on Enterprise Liquidity Management applications. Venkat also has experience as a Presales Solutions Architect at Infosys and worked on Enterprise solutions for Credit Cards at Capgemini. Venkat holds a Master of Technology in Data Science from Birla Institute of Technology and Science, Pilani, and a Bachelor of Technology in Engineering from JNTUH College of Engineering Hyderabad.