Deiva S

Deiva S has a strong background in IC packaging engineering, with experience at several prominent companies. They began their career at STATS ChipPAC Ltd. as an Assembly Engineer from 2000 to 2003. They then moved on to SPEL Semiconductor limited in India, where they served as the Head of Engineering and Operations from 2003 to 2015. During this time, they focused on product and process development, line management, and operations. They also installed, qualified, and optimized a QFN line. In 2017, Deiva joined Skyworks Solutions, Inc. USA as a Microelectronics Staff Packaging Engineer, responsible for package design and development for automotive and RF applications. They worked on multi-chip modules and successfully ramped up production. Deiva then joined Tesla in 2021 as an SIE-IC Packaging Engineer, where they were responsible for chip packaging design and manufacturing integration for Auto Pilot and AI applications. They also handled new supplier qualification. Currently, Deiva is working at Semtech as a Principal IC Packaging Engineer, focusing on the design and development of various packaging technologies for RF and automotive applications. This includes QFN, MLGA, and wafer and panel-level packaging. They also carry out thermal simulations for package design.

Deiva S holds a Master's degree in Business Administration and Management, General from Pacific University. Prior to that, they obtained a Bachelor of Engineering degree in Mechanical Engineering from Madurai Kamaraj University.