Smit Patel

ASIC Physical Design Engineer at SignOff Semiconductors

Smit Patel is an ASIC Physical Design Engineer at SignOff Semiconductors since September 2022, specializing in the field of electrical and computer engineering. Prior to this role, Smit served as a QC and System Engineer at VINROX TECHNOLOGIES LLP from August 2019 to January 2021. Smit holds a Master of Engineering (MEng) in Electrical and Computer Engineering from the University of Windsor, completed in July 2022, and an undergraduate degree in Electronics and Communication from G H Patel College of Engineering & Technology, obtained in 2019.

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