Ariel Tan

Ariel Tan is an accomplished Principal Package Development Engineer with extensive experience in integrated circuit packaging design and process solutions. Currently at Silanna since March 2019, Ariel develops new products from design through qualification and utilizes finite element analysis and CFD software for thermal validation. Previously, at ON Semiconductor, Ariel managed cost-effective automotive package solutions and led programs for automotive power products. In earlier roles at International Rectifier, responsibilities included managing assembly and test subcontractor accounts in Southeast Asia and serving as project manager for new power package development initiatives. Ariel's career began at Cypress Semiconductor, focusing on new package operations and cost reduction. Holding a Master of Science in Material Science Engineering and a Bachelor of Science in Mechanical Engineering from Mapúa University, Ariel combines technical expertise with a strong background in engineering.