Bassel Haddad

Bassel Haddad is a seasoned executive in the technology sector, currently serving as Senior Vice President and General Manager of Advanced Packaging at SkyWater Technology since September 2024. Prior to this role, Bassel Haddad held several senior positions at Intel Corporation, including Vice President and General Manager of Edge Device and AI, Network & Edge Group, where responsibilities included driving a diverse portfolio involving Edge Compute, AI inference, and Wireless Connectivity. Additional roles at Intel involved leadership in global organizations focused on business strategy, product definition, and the Intelligent Edge Product Portfolio. Previous experience includes serving as Director of System Engineering at SiPort, Director of Engineering at Telegent Systems, and Principal System Architect at Zoran Microelectronics. Bassel Haddad holds a Master of Science degree in Electrical Engineering from the Technion - Israel Institute of Technology.