Youssef Hamid, PhD

Principal MEMS Packaging Engineer at Sofant Technologies

Youssef Hamid has a wealth of experience in MEMS packaging engineering, specializing in RF antenna arrays and infrared sensors. With a background in mechanical design engineering and extensive experience in various industries such as motorsport, healthcare, and oil & gas, Youssef has a strong foundation in both theoretical knowledge and practical application. Youssef's educational background includes a PhD in MEMS packaging and performance analysis, as well as an MSc in Mechanical and Manufacturing Engineering. Youssef has also demonstrated leadership skills through various roles in leading ERP system deployments and user training workshops.

Links

Timeline

  • Principal MEMS Packaging Engineer

    January 1, 2024 - present

  • Senior MEMS packaging Engineer

    October, 2022

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