Jesse Osmond

Building Envelope Sales Engineering Representative at Soprema Inc.

Jesse Osmond has a diverse work experience in the field of building science and engineering. They most recently worked as a Building Envelope Sales Engineering Representative at SOPREMA USA starting in July 2023. Prior to that, Jesse was a Graduate Enclosure Consultant - Diagnostics at Walter P Moore from May 2022 to June 2023.

Before these roles, Jesse worked as a Junior Building Science Engineer at Brown & Beattie Ltd. from August 2020 to April 2022. They also had the opportunity to work at Entuitive as a Building Envelope Specialist in both 2020 and 2019, undertaking various tasks such as design drawings, field reviews, and research.

Jesse's previous work experience includes roles such as a Field Coordinator at PCL Construction, where they supervised construction and ensured adherence to design drawings. They were also an Undergraduate Research Assistant at the University of Waterloo, assisting in research projects.

Furthermore, Jesse gained experience as a Transportation Planner at AECOM, where they were involved in transportation infrastructure improvement design and evaluation. They also worked as an Engineering Field Technician at Terraprobe Inc., specializing in quality control testing.

Finally, Jesse's work experience began as a Construction Laborer at Minitaki Carpentry, providing valuable hands-on experience in the construction industry.

Overall, Jesse Osmond's work experience demonstrates a strong background in building science, engineering, and construction, with a focus on building envelope and sustainable practices.

Jesse Osmond completed their Bachelor of Applied Science (BASc) degree in Civil Engineering from the University of Waterloo. They enrolled in this program in 2016 and completed it in 2021. Following this, Jesse pursued further education at Ryerson University, where they enrolled in the Master of Building Science program with a focus on Building Enclosure Design and Diagnostics. Their expected completion date for this program is in 2023.

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