Michael Trammel

Michael Trammel has extensive work experience in various engineering roles. Michael currently serves as the Director of Engineering at Summit Interconnect since December 2019. Before this, they held the position of Director of Engineering at Streamline Circuits since June 2016. Michael also worked as a Field Application Engineer at Streamline Circuits starting from December 2014.

Prior to their roles at Streamline Circuits, Michael was the Business Development Manager at INSULECTRO from July 2014 to December 2014. Michael also worked at Integral Technology Inc as a Manager of Field Application Engineering from January 2014 to July 2014. Before that, they served as a Technical Service Specialist at Integral Technology Inc from November 2009 to January 2014.

Michael has also worked as the Director of Engineering at DDI from December 1999 to November 2009. Michael was responsible for directing activities for front end and process engineering teams, introducing new technology and processes, and managing capital expenditures.

Before joining DDI, Michael worked at Rohm and Haas as an Advanced Technology Engineer from November 1998 to November 1999. Michael also worked as a Technical Sales Engineer at Morton Electronic Materials from January 1995 to November 1998.

Michael's earlier experiences include working as a Technical Service Engineer at B&B Custom Circuit Supply from 1993 to August 1995, and as an Operations Manager at Phototek Inc from January 1989 to January 1993.

Throughout their career, Michael has demonstrated strong leadership, technical expertise, and experience in engineering and business development.

Michael Trammel attended Phillips College from 1988 to 1990, where they earned an associate's degree in Electronic Technology. Their field of study was Electronics/Electrical Engineering. Prior to that, from 1980 to 1981, they attended Columbia Basin College, but no degree or specific field of study information is provided for that period.