Ruiyang Liu

Ruiyang Liu, Ph.D. is a Lead packaging engineer at TeraDAR, currently working on materials and mechanical reliability for products. Previously, Ruiyang was an IC packaging engineer at Apple, contributing to the development of the M1 series. As a Ph.D. student researcher at the Thomas J. Watson School of Engineering and Applied Science, Ruiyang focused on mechanical and fracture mechanics analysis for packaging products. With experience as a teaching assistant and intern, Ruiyang has a background in various engineering tasks and projects, including viscoelasticity characterization, finite element analysis, and undergrad thesis on finite element modeling. With degrees from Binghamton University and Harbin Institute of Technology in Mechanical Engineering and Electronics Packaging Technology, Ruiyang Liu, Ph.D. has a strong foundation in the field.