Floro Camenforte III

Floro Camenforte III has worked in the engineering field since 2007. Floro began their career at Texas Instruments as a Packaging Engineer, working on Flip Chip QFN and Clip QFN. Floro then held the role of Packaging Engineering Manager for FC QFN and Clip QFN, followed by Packaging Engineering Manager for Advanced Wirebonded QFN. In 2021, they began work at Transphorm Inc. as a Senior Packaging Engineer.

Floro Camenforte III obtained a Bachelor of Science in Electronics and Communications Engineering from the University of San Carlos in Cebu City, Philippines between 2000 and 2005. In July 2021, they obtained two certifications from LinkedIn, Electronics Foundations: Basic Circuits and Electronics Foundations: Fundamentals.