Hargurpreet Singh is a seasoned engineering professional with over 16 years of experience in the semiconductor industry. Currently serving as a Principal Product Engineer at TSMC since December 2011, Hargurpreet is responsible for driving continuous improvement in specialty foundry technology, focusing on reducing defect density and enhancing power performance while interfacing with leading Fabless clients for yield improvement. Prior experience includes a role as an SRAM Development/Characterization Engineer at IBM from August 2006 to December 2011, where Hargurpreet contributed over seven years in electrical characterization and semiconductor technology development. Early career experience includes internships at Intel and IBM, focusing on stress testing and statistical screening of semiconductor defects. Hargurpreet holds a Master’s degree in Electrical and Computer Engineering from Portland State University and a Bachelor’s degree in Electrical and Electronics Engineering from GNDEC.
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