Po-Yao Lin

Po-Yao (Thomas) Lin is a seasoned Technical Manager at TSMC with extensive experience in advanced packaging technology and thermal reliability characterization. Since joining TSMC in August 2008, Lin has contributed to crucial developments in the System Package Integration Program, establishing key labs and leading teams to innovate in thermal simulation for packaging solutions. Lin has authored several significant papers, including works presented at the IEEE Electronic Components and Technology Conference and the International Reliability Physics Symposium. Prior to TSMC, Lin held positions at Intel as a Senior Technical Marketing Engineer, ASUS as a Manager in thermal design, Acer as a Senior Engineer, and ITRI as an Associate Engineer, instrumental in thermal design for various products. Lin's academic credentials include a BS in Mechanical Engineering, an MBA in International Business, an MS in Power Mechanical Engineering, and a PhD in Materials Science and Engineering from prestigious universities in Taiwan.