Chiapin Lee

ChiaPin Lee currently serves as Vice Chairman of the Board at Asia Pacific Microsystems, Inc. since June 2024. Previously, ChiaPin Lee has been involved with 欣興電子 since September 2008 in various roles including Advisor, Vice CEO, and President. From June 1998 to September 2008, ChiaPin Lee held the position of Vice President at UMC, focusing on manufacturing and 12" fab operations. Earlier career experience includes serving as a Member of Technical Staff at HP from 1984 to 1997. ChiaPin Lee holds an MBA from Oregon State University, completed in 1991, and pursued an MSEE degree while being a PhD candidate in Electrical Engineering at the same institution from 1980 to 1984.