Tai-Ming Lin

Tai-Ming Lin is a highly skilled engineer with extensive experience in process integration and semiconductor manufacturing. Currently serving as a Staff Process Integration Engineer at Alpha & Omega Semiconductor since June 2023, Tai-Ming has previously held the position of Sr. Process Engineer at Microfabrica from November 2021 to April 2023 and worked as a Process Integration Engineer at Global Communication Semiconductors, Inc. from August 2016 to November 2021. Tai-Ming's expertise includes developing manufacturing processes for GaN HEMTs and InP HEMTs, conducting failure analysis, and improving product yields. Earlier roles include research assistant and graduate student researcher in the Compound Semiconductor Device Lab at National Chiao Tung University, and a summer internship at TSMC. Educational credentials include a Master's degree in Electrical and Electronics Engineering from the University of Michigan and two Master's degrees and a Bachelor's degree, all in Materials Science and Engineering from National Chiao Tung University.