Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company's packaging and test services are designed to meet application and chip specific requirements, including the type of interconnect technology; size, thickness and electrical, and mechanical and thermal performance. It provides packaging and test services, including semiconductor wafer bump, wafer probe, wafer backgrind, package design, packaging, system-level, and final test and drop shipment services. The Company provides its services to integrated device manufacturers (IDMs), fabless semiconductor companies and contract foundries. IDMs design, manufacture, package and test semiconductors in their own facilities. The Company offers a range of advanced and mainstream packaging and test services. The Company's mainstream packages include leadframe packages, substrate-based wirebond packages and micro-electro-mechanical systems packages.

Semiconductor

Amkor Technology

Giel Rutten

Megan Faust

John Stone

Mark Rogers

Steve Shin

The board of directors at Amkor Technology has a long history of experience in electrical engineering and research and development. They have also served on the boards of directors for other companies, including Innovative Solutions & Support, Clery Center, R&D Altanova, and BIG PICTURE PHILADELPHIA.

Board of Directors

CEO and Executive Team

Leadership Team

Board of Directors

About

Team members

Other teams at Amkor Technology

CEO and Executive Team

Leadership Team