David Leigh

David Leigh began their career in 1984 as an Engineer at Dataproducts, where they reduced overheating of dot matrix printers by performing thermal analysis, designing power supply heatsinks, and specifying fans, as well as testing and revising paper feeder designs for improved performance at temperature and humidity extremes. In 1985, they joined Owens Design as an Engineer, where they designed and programmed multiple stations for Biotrack medical diagnostic devices, developed multiple web processing tools for Lifescan home blood glucose monitors, and wrote PLC code for Komag disc drive tools. In 1994, David Leigh moved to Hewlett-Packard, where they held three positions: Electrical/Hardware Engineer V, Hardware Design Engineer, and Manufacturing Development Engineer. At Hewlett-Packard, they developed numerous fixtures and tools to enable die to wafer attach and wafer to wafer bonding, developed concepts for high efficiency solar cell manufacturability, designed two high volume printhead assembly tools, managed project schedules and resources, implemented continued improvements, designed yield and downtime improvements to high volume flex laser ablation tools, developed world standard multi-product bonder E-test and punch, and reduced particle contamination by developing flex and interleaf cleaning tools. In 2010, David Leigh became a Senior Mechanical Engineer at Andrews-Cooper Technology, Inc.

David Leigh attended California Polytechnic State University-San Luis Obispo from 1979 to 1983 and obtained a Bachelor of Science in Mechanical Engineering (BSME).