Chinghsin Shih

Chinghsin Shih is a skilled engineering professional with significant experience in package design and layout. Currently serving as a Senior Package Engineer at Astera Labs since June 2024, Chinghsin Shih conducts early-stage package size evaluations to optimize feasibility and cost-performance while ensuring timely project delivery. Previously, at Shanghai Anlogic Infotech Co., LTD. from March 2021 to September 2023, responsibilities included optimizing design communication and ensuring design data feasibility with suppliers. Earlier experience includes a role as a Design Engineer at 日月光集團 from August 2012 to February 2021, where Chinghsin Shih developed package outline drawings and addressed out-of-spec issues. Chinghsin Shih holds a Master’s degree in Mechanical Engineering from National Kaohsiung University of Applied Sciences.