Sameer Dhandarphale

Sameer Dhandarphale's work experience begins in 2019 where they worked as a Graduate Research Assistant at the Electronics, MEMS & Nanoelectronics Systems Packaging Center (EMNSPC) at The University of Texas at Arlington. During this time, they focused on developing and improving testing methods for board level reliability (BLR) of microelectronic packages. Sameer also conducted research on the impact of a novel liquid immersion cooling technique on the long-term reliability of PCBs. Additionally, Sameer performed material characterization using various testing methods on new packaging materials.

In 2020, Sameer also worked as a Teaching Assistant at The University of Texas at Arlington. In this role, they supervised students in the Computer Aided Design Lab, providing guidance on design projects using software such as SolidWorks and ANSYS Workbench. Sameer also assisted a professor in an Astronautics Course, answering student questions, and grading assignments.

From 2021 to 2023, Sameer worked at Micron Technology as a Reliability Engineer- Packaging. Sameer'sresponsibilities included developing and improving environmental and mechanical testing for microelectronic package reliability. Sameer also led the qualification of the DRAM product line and addressed customer issues related to solder joint integrity.

As of 2023, Sameer is currently employed at Celestial AI as a Packaging Engineer.

Sameer Dhandarphale completed their education in Mechanical Engineering. Sameer earned a Bachelor's degree in Mechanical Engineering from Savitribai Phule Pune University, studying from 2012 to 2017. Sameer later pursued a Master's degree in the same field from The University of Texas at Arlington, attending from 2018 to 2020.

In addition to their academic degrees, Sameer obtained two certifications. Sameer completed the "Operational Excellence Foundations" certification from LinkedIn in August 2020. Sameer also obtained the "MATLAB Onramp" certification from MathWorks in April 2020.