Frans Meeuwsen

Frans Meeuwsen is a highly experienced Senior Package Engineer at CITC - Chip Integration Technology Center, having commenced this role in December 2023. Prior to this, Frans served as Architect Package Development at Sempro from March 2021 to November 2023 and as Senior Engineer, Package Design at Ampleon between December 2015 and March 2021. At Ampleon, responsibilities included designing new package platforms and creating intellectual property for these platforms, as well as developing new packages and assembly processes for RF-power products. Early career experience includes positions as Package & Assembly Engineer at NXP Semiconductors and Development Engineer Package Concepts at Philips. Educational qualifications encompass a range of engineering and technical disciplines, including a Metals & Alloys bachelor's degree from Philips, a background in Statistical aspects of Reliability, and training in Autodesk software.