Erick M. Spory

Erick M. Spory spent 22 years at Atmel Corporation in Colorado Springs, CO, ultimately becoming a Senior Principle Failure Analysis Engineer. During his time at Atmel he worked closely with process, design, device, and packaging engineers to resolve yield issues.

He is currently the President and CTO of Global Circuit Innovations, which he co-founded in 2006. Mr. Spory holds 15 patents and has 4 other patents pending. These involve Environmentally Hardened Integrated Circuits, Methods for Printing Integrated Circuit Bond Connections, Repackaged Integrated Circuit and Assembly Methods, Extracted Die and Reassembly and Counterfeit Mitigation.

Mr. Spory has published numerous papers for a variety of publications, including the International Symposium for Testing and Failure Analysis and International Microelectronics Packaging and Assembly Society (IMAPS). He has presented at over twelve conferences including the Component Obsolescence Group (COG), International Microelectronics Assembly & Packaging (IMAPS) Components for Military and Space Electronics, Surface Mount Technology Association SMTA) Electronics in Harsh Environments, Afnor Obsolescence Organization, and multiple times at the Diminishing Manufacturing Supply and Material Shortages (DMSMS).

Mr. Spory has a B.S. in Materials Science Engineering with a Chemical Engineering Minor from Cornell University. Mr. Spory also has a M.S. in Electrical Engineering with a Microelectronics emphasis from the University of Colorado, Colorado Springs (UCCS) and is a current Candidate for a Ph.D. in Electrical Engineering from the University of Colorado.