Harry Nguyen

Senior Engineer at Global Unichip Corp

Harry Nguyen is a highly skilled engineer with extensive experience in the field of physical design and application engineering. Currently serving as a Senior Engineer at GUC since July 2023, Harry's previous roles include Senior Application Engineer and Application Engineer at Synopsys Inc, ASIC Physical Design Engineer at Faraday Technology Vietnam, Physical Design Engineer at Renesas Electronics, and an internship in Assembly Engineering at Intel Corporation. Academic achievements include a Master's degree in Electronics Engineering from Ho Chi Minh City University of Technology, expected to be completed in December 2023, and an Engineer's degree in Electrical and Electronics Engineering from the same institution, earned in October 2019.

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