Derek Pai

Derek Pai's work experience includes serving as the Chief Product Officer at Griptape since 2023. Prior to this, they worked at Amazon Web Services (AWS) as a Principal Product Manager from 2021 to 2023, and at Amazon as a Principal Product Manager from 2020 to 2021. Derek also had extensive roles at Amazon Web Services, starting as a Principal Product Manager from 2018 to 2020 and previously from 2015 to 2017, and as a Sr. Product Manager from 2010 to 2013. Prior to their time at Amazon, they worked at Microsoft Corporation as a Sr. Product Manager from 2008 to 2010. Additionally, they gained experience as a Product Management Intern at Amazon.com and as a Sr. Project Engineer at Volkswagen of America Electronics Research Lab. Derek started their career as a Mechanical Engineer at Arcturus Bioscience, Inc and as a Product Engineer (intern) at IBM.

Derek Pai holds a BS degree in Engineering Product Design from Stanford University, which they earned between 1994 and 1998. Derek also has an MS degree in Mechanical Engineering from Stanford University, completed from 1998 to 1999. Moreover, they obtained an MBA degree from Northwestern University - Kellogg School of Management, attending from 2006 to 2008.