David Walshak

David Walshak has extensive experience in the field of semiconductor packaging and assembly. David has worked as a Director of Packaging Engineering at IDEX Biometrics since 2017, where they have been responsible for integrating fingerprint sensors into various applications. David has also provided guidance on semiconductor packaging and assembly, and has interacted with potential suppliers and manufacturing partners.

Prior to their role at IDEX Biometrics, David worked as a Tasker at TaskRabbit from 2016 to 2017, where they undertook various handyman activities. David has also worked as a Consultant in the field of Semiconductor Packaging/Assembly from 2015 to 2017.

David has a long history of experience at AMD, where they held various roles from 2003 to 2015. David served as a Senior Member of Technical Staff, Manager, and Section Manager/Department Manager during their time at AMD. In these roles, they led efforts to qualify bump structures for future programs, developed hardware utilized by platform-validation teams, and supported the mechanical design of specific GPU products.

Earlier in their career, David worked as the Director of Applications at Winbond, the Applications Engineering Manager at Sheldahl MicroProducts, the Sr. Assembly Engineer at Cirrus Logic, and a Member of the Technical Staff at MCC.

Overall, David Walshak has a diverse background in semiconductor packaging and assembly, with experience in leadership roles, program planning, and problem-solving. David is known for their integrity and collaborative approach to achieving success.

David Walshak completed their education at The University of Texas at Austin. David obtained their Bachelor of Science in Mechanical Engineering degree from 1978 to 1982. Later, they pursued further studies and earned a Master of Science in Mechanical Engineering degree from 1982 to 1984.