Senior Packaging/assembly Engineer

Engineering · Brandenburg, Germany

Job description

Overview

Do you enjoy working in a creative fast-growing entrepreneurial environment? With indie you´ll never walk alone! We place high value on our teams and pursue excellence for our employees and customers!

indie is empowering the Autotech revolution with next generation automotive semiconductors and software platforms. We focus on edge sensors spanning multiple modalities including LiDAR, radar, ultrasound and vision for Advanced Driver Assistance Systems (ADAS), autonomous vehicles, connected car, user experience and electrification applications.

Tasks and Responsibilities:

  • Define advanced package requirements
  • Select and qualify advanced package technologies, materials and surface mount
  • processes
  • IC package design and supervision of assembly process
  • Support package reliability investigations and failure analysis
  • Support production ramp-up and process optimization programs
  • Support the selection, evaluation and co-ordination of subcontractor manufacturing.
  • Experience in guiding and controlling external suppliers.
  • Work with foundry and OSAT to bring packaging solution from concept to HVM
  • Experience in RF packages fcCSP beneficial

Job Requirements:

With us, you must love being part of an organization where everyone makes a difference and contributes to the company’s success. Creativity, Ownership and Excellence are what we value. These are the skills and know how an ideal candidate would bring. We understand that nobody is perfect! After all, your new job should challenge you and you should have the possibilities to grow.

  • Engineering Master’s degree in an electronic or microelectronic field with 5+ years of industrial experience in advanced IC packaging
  • Excellent interpersonal skills and has strong business partnership building and collaboration with multi-functional teams and overseas suppliers
  • General understanding of packaging technologies, assembly processes, IC packaging materials, reliability standards, FA techniques, etc.
  • Professional experience in project management with international partners
  • Shown capabilities using package design softwares, APD, Altium Designer, Virtuoso, etc.
  • Knowledge in any of these tools would be a plus: ->CST Studio Suite, Ansys HFSS, Ansys Q3D, Ansys SIwave, Cadence Sigirty

What we Offer:

  • Full-time job with long-term prospects
  • Work independently in an international, modern company
  • A challenging job in a dynamic high-tech innovative company
  • The opportunity to take ownership of your professional passion
  • An enjoyable, team-oriented and professional atmosphere
  • Versatile development opportunities
  • Flexible working hours

indie Semiconductor and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. 

We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

Concerning agencies: indie Semiconductor does not accept unsolicited resumes and will not be responsible for fees related to such.