Daniel Lopez-Diaz

Daniel Lopez-Diaz has a diverse work experience in the field of RF/IC design engineering. Daniel is currently working as a Principal RF/MS IC Design Engineer at MaxLinear since November 2022. In 2023, they are set to become a Lecturer at FH Joanneum. Prior to their current roles, Daniel worked at NXP Semiconductors as a Principal System/IC Architect from March 2019 to November 2022, where they were responsible for defining system/IC architecture for NFC connected tags and UHF RFID tags, inventing a patent for detecting and mitigating electromagnetic interference in connected RFID tags, and translating product requirements to specifications. Before NXP, Daniel was a Senior Staff Engineer RFIC Design at Intel Corporation from April 2015 to February 2019, where they led the design of WiFi transmitters and introduced an innovative mixer architecture. Daniel also worked as a Senior RFIC Design Engineer at Lantiq, an Intel Company, from May 2013 to April 2015. Daniel started their professional career as a Ph.D. Student at Fraunhofer IAF from February 2009 to April 2013, where they developed communication chips achieving world records in speed and co-authored publications. Daniel also designed chipsets for radar and wireless data transmission. Prior to that, Daniel briefly worked as an Analog Design Engineer at Freescale Semiconductor and as an intern in Analog IP Development. Daniel started their career as a Student Trainee at Ringwald Mikroelektronik, where they were responsible for hardware and software development for embedded systems.

Daniel Lopez-Diaz completed their doctoral degree in Electrical Engineering at Universität Stuttgart, receiving a PhD, Dr.-Ing. in 2014. Prior to that, they attended Karlsruhe Institute of Technology (KIT) from 2002 to 2008, where they earned their Dipl.-Ing. (MSE equivalent) degree, also in Electrical Engineering.