Hyundoo Shin

Hyundoo Shin is a seasoned software engineering professional with extensive experience in embedded systems and wireless communication technologies. Currently serving as a Principal SW Engineer at MediaTek since November 2022, Hyundoo has previously held key roles at Rivian, Apple, Cypress Semiconductor Corporation, Qualcomm, Texas Instruments, Ceyon Technology, and LG Electronics. Notable contributions include the integration of fingerprint software frameworks in embedded systems, development of firmware for battery management systems, and leadership in mobile software and connectivity projects. Hyundoo holds a Master’s Degree in Telecommunications from the University of Pittsburgh and a Bachelor of Engineering in Electronics Engineering from Sungkyunkwan University.