Hinns Benny

Hinns Benny is a Package Design Engineer at Micron Technology since March 2024, following a comprehensive internship as a Semiconductor Packaging Engineer at NXP Semiconductors. Having completed a Master of Science in Industrial Engineering at Arizona State University, Hinns also gained relevant experience as a Chemical Inventory Assistant and a Research Aide during academic tenure. Previous roles include a Sales and Marketing Intern at Aramark, a Travel Coordinator at Hinns Tours & Travels Pvt. Ltd, and a Subject Matter Expert for Chegg India. Hinns possesses a Bachelor of Technology in Mechanical Engineering from APJ Abdul Kalam Technological University and has engaged in practical projects involving finite element analysis and object-oriented programming.