Lee Tze How

Lee Tze How is a seasoned professional in compensation and benefits, currently serving as the Director of APAC Compensation & Benefits at Micron Technology. Previously, Lee held progressive roles within the same company, advancing from Manager to Senior Manager in the APAC Compensation & Benefits department. Earlier in Lee's career, experience included a position as Senior Engineer at TECH Semiconductor Singapore. Lee holds a Bachelor of Engineering (BEng) degree in Chemical Engineering from the National University of Singapore, completed in 2006.