Timothy Niedermeyer

Timothy Niedermeyer has a diverse work experience spanning several companies and roles. Timothy is currently working as a Lead Digital RTL Engineer at MicroVision since May 2022. Prior to this, Timothy worked at Collins Aerospace as a Principal Electrical Engineer from February 2019 to April 2022. Timothy was responsible for FPGA design and verification for various projects. Before that, Timothy served as a Senior Firmware Engineer at Blackmore Sensors and Analytics, Inc. from January 2018 to January 2019, where they focused on FPGA design for automotive LiDAR systems. From June 2013 to June 2017, they worked as an Electrical Design Engineer at Rockwell Collins, where their responsibilities included FPGA design and verification for multiple projects. Timothy also has experience as a Research Assistant at the Oregon State Magnetics Lab from June 2011 to June 2013, where they designed and built measuring equipment and assisted graduate students with their research. Timothy started their career as a Hardware Engineering Intern at Insitu, Inc. in June 2012.

Timothy Niedermeyer completed their Bachelor of Science (BS) in Electrical and Computer Engineering from Oregon State University between 2009 and 2013.