LW

Liqun Wang

SVP Of Payanywhere And Payments Hub Engineering at North American Bancard

Liqun "Lea" Wang has extensive work experience in the technology and engineering industry. Liqun "Lea" began their career at MCI as a Software Developer from 1995 to 1997. From there, they worked at Hewlett Packard as a Software Design Engineer from 1997 to 2000. Wang then joined Sun Microsystems, Inc. where they started as a Senior Software Engineer from 2000 to 2004, before progressing to an Engineering Manager role from 2004 to 2011. During their time at Sun Microsystems, they managed and led various projects including Project Kenai for kenai.com, odftoolkit.org, and netbeans.org. Wang also worked at Oracle as a Development Manager from 2010 to 2011, where they managed and led Project Kenai, a Ruby on Rails application that served as a foundation for java.net, kenai.com, and odftoolkit. In 2011, they became the Director of Engineering at WayIn for a brief period of time before joining Valassis as the Director of Engineering, Digital Media from 2011 to 2016. Currently, Wang holds the position of SVP of Payanywhere and Payments Hub Engineering at North American Bancard since January 2022. Prior to this, they served as the VP of Payanywhere and Payments Hub Engineering starting in May 2016.

Liqun "Lea" Wang holds a Bachelor of Science degree in Electrical Engineering from the University of Florida.

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Timeline

  • SVP Of Payanywhere And Payments Hub Engineering

    January, 2022 - present

  • VP Of Payanywhere And Payments Hub Engineering

    May, 2016

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