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howard allen

Senior Package Engineer at Rochester Electronics

Howard Allen is a senior package engineer at Rochester Electronics, LLC since April 2021, with previous experience as a principal package engineer at ON Semiconductor from October 2015 to April 2021. At ON Semiconductor, responsibilities included designing lead frames for advanced applications in automotive sectors and providing comprehensive package-related deliverables for new product development. Prior to this, Howard served as a staff semiconductor package engineer at Fairchild Semiconductor from June 1997 to October 2015, where development and implementation of the standard package development methodology were key contributions, along with training across various international sites. Howard holds an associate's degree in Electrical and Electronics Engineering from Eastern Maine Community College, obtained between 1982 and 1984.

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