Ho Wong

HO Wong is currently a Principal Engineer at Samsung Electro-Mechanics, focusing on Flip Chip BGA Product Development. Previously, they worked at Intel Corporation for over 17 years in various roles such as Chip Assembly NPI Integrator, Chip Assembly Manager, Manufacturing Technologist, Equipment Development Technologist, Chip Assembly Operation Lead, and Chip Assembly Process & Equipment Engineer. Their extensive experience involves leading engineers through NPI product transfers with next-generation chip packaging technology, collaborating with US development teams.