Cassandra Hibbs

Team Lead, Silicon Photonics Packaging at Silitronics Solutions

Cassandra Hibbs has gained work experience in various engineering roles. Cassandra worked as a Sr Process Development Engineer at Silitronics Solutions Inc since February 2023. Prior to that, they worked at Mercury Systems as a Manufacturing Engineer II from October 2022 to January 2023 and as a Manufacturing Engineer I from June 2021 to November 2022. Cassandra also worked as an Engineering Intern at Meggitt from June 2019 to September 2019. Before that, they served as an Engineering Assistant at SIDUS Solutions, LLC from November 2017 to August 2018, and as a Mechanical Engineering Intern at the same company from June 2017 to August 2017.

Cassandra Hibbs attended UCLA from 2018 to 2021. During this time, they pursued a degree in Mechanical and Aerospace Engineering with a focus on Computer Science.

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