Levente Toth

Principal Embedded Software Engineer at Tepeo

Levente Toth has worked in the software engineering industry since 1998. Levente began their career at Racal Messenger Ltd. as a DSP Design Engineer, where they designed and implemented key parts of a multi-DSP real-time car licence plate recognition system. Levente then moved to Nokia in 2000, where they worked as an Audio Engineering Senior Technology Architect and Package Owner. During their time there, they authored DSP system designs for several Nokia-first and world-first features, and steered 3rd party chipset suppliers in design and implementation. In 2011, they moved to Accenture as an Applications Technical Architect, where they were the audio HW control and chipset API technical lead. In 2012, they joined CSR as a Staff Embedded SW Engineer for Audio DSP SW Architecture. In 2015, they moved to Qualcomm as a Staff Embedded SW Engineer for Audio DSP Architecture, and in 2016, they took a creative career break to pursue photography and music projects. In 2017, they joined ARM as an Image Processor Modelling Expert (Consultant), and in 2019, they took a sabbatical to care for their mother and organise long term care in their home country. Levente is currently employed as a Senior Embedded Software Engineer at Tepeo.

Levente Toth obtained a Bachelor of Science (BSc) degree in Electronic Engineering from the Technical University of Cluj Napoca between 1990 and 1995. Prior to this, they attended the Bolyai Farkas Lyceum between 1986 and 1990, studying Mathematics & Physics. Levente then went on to pursue a PhD in Artificial Intelligence and 3D Object recognition at the University of Plymouth between 1995 and 1998. Levente has also obtained a Chartered Engineer certification from the Institution of Engineering and Technology (IET).

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Timeline

  • Principal Embedded Software Engineer

    February, 2020 - present