Andrew Metz

Andrew Metz has extensive work experience in the semiconductor industry. Andrew started their career at Intel in 2003, where they worked as a Sr. Process Engineer for Low K Dielectrics Deposition from November 2003 to April 2006. Andrew then became an Engineering Group Leader for Thin Film Dielectrics Deposition from April 2006 to May 2007.

In May 2007, Andrew joined Tokyo Electron US as a Sr. Process Engineer for Reactive Ion Etch. Andrew held this position until May 2010 when they were promoted to Principal Process Engineer for the same technology. From June 2014 to September 2021, they served as a Member of the Technical Staff. Currently, they hold the role of Director of Etch Technology, starting in October 2021.

Throughout their career, Andrew has gained expertise in etch technology and process engineering, making him a valuable asset in their field.

Andrew Metz earned a Bachelor of Science degree in Chemistry from the University of Nebraska-Lincoln in 1999. Andrew then pursued a Ph.D. in Inorganic Chemistry at Northwestern University from 1999 to 2003. There is no information available about their education history at San Jose State University.